Mobile Phone PCBA board

Our Service:

The Mobibe Phone PCB is made of Shengyi S1000-2M material, the surface is gold-plated and partially thick gold-plated production technology, the minimum aperture is 0.15mm, the minimum line width and line spacing is 120/85um, it is an ideal circuit board for optical fiber communication equipment product.

Product Detail

Product Tags

Products feature

● -HDI/Any-layer/mSAP

● -Fine line and multilayer manufacture capability

● -Advanced SMT and after assembly equipment

● -Exquisite craft

● -Isolated function test capability

● -Low loss material

● -5G Antenna Experience

Our Service

● Our Services: One-stop PCB and PCBA electronic manufacturing services

● PCB manufacturing service: Need Gerber file(CAM350 RS274X), PCB files (Protel 99, AD, Eagle), etc

● Components sourcing services: BOM list included detailed Part number and Designator

● PCB assembly services: The above files and Pick and Place files, assembly drawing

● Programming & Testing services: Program, instrouction and test method etc.

● Housing assembly services: 3D files, step or others

● Reverse engineering services: Samples and others

● Cable & wire assembly services: Specification & others

● Others services: Value-added services

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PCB Techinecal Capacity

Layers Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size 1150mm × 560mm
Aspect Ratio 18:1
Surface Finish HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

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