Vehicle Electronics PCBA board

Our Service:

Automotive PCB manufactures to accumulate abundant experience in production control processes and technologies. Our automotive product offering is extremely diverse in categories such as heavy copper, HDI, High-frequency and High-speed. These are used for the production of connected mobility, automated mobility and the increasing electrified mobility

The technology demand of longer life time, higher temperature load and smaller pitch design can be met absolutely. We have strategic cooperation with major suppliers to develop and implement new materials, equipment and process development for current and future automotive technologies.

Product Detail

Product Tags

Products feature

● -Reliability testing

● -Traceability

● -Thermal management

● -Heavy copper ≥ 105um

● -HDI

● -Semi - flex

● -Rigid - flex

● -High frequency milimeter microwave

PCB structure characteristics

1. Dielectric layer (Dielectric): It is used to maintain the insulation between lines and layers, commonly known as the substrate.

2. Silkscreen (Legend/Marking/Silkscreen): This is a non-essential component. Its main function is to mark the name and position box of each part on the circuit board, which is convenient for maintenance and identification after assembly.

3.Surface treatment (SurtaceFinish): Since the copper surface is easily oxidized in the general environment, it cannot be tinned (poor solderability), so the copper surface to be tinned will be protected. The protection methods include HASL, ENIG, Immersion Silver, Immersion TIn, and organic solder preservative (OSP). Each method has its own advantages and disadvantages, collectively referred to as surface treatment.

SVSV (1)
SVSV (2)

PCB Techinecal Capacity

Layers Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size 1150mm × 560mm
Aspect Ratio 18:1
Surface Finish HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

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