Computer and Peripherals PCBA board

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Platforms for computing continue to grow with regard to speed, capability and information storage/exchange. The demand for cloud computing, big data, social media, entertainment and mobile applications continues to grow and drive the need for more information in shorter time.

Product Detail

Product Tags

Products feature

● -Material: Fr-4

● -Layer Count: 14 layers

● -PCB Thickness: 1.6mm

● -Min. Trace / Space Outer: 4/4mil

● -Min. Drilled Hole: 0.25mm

● -Via Process: Tenting Vias

● -Surface Finish: ENIG

PCB structure characteristics

1. Solderresistant ink (Solderresistant/SolderMask): Not all copper surfaces have to eat tin parts, so the non-tin-eaten area will be printed with a layer of material (usually epoxy resin) that isolates the copper surface from eating tin to avoid non-soldering. There is a short circuit between the tinned lines. According to different processes, it is divided into green oil, red oil and blue oil.

2. Dielectric layer (Dielectric): It is used to maintain the insulation between lines and layers, commonly known as the substrate.

3. Surface treatment (SurtaceFinish): Since the copper surface is easily oxidized in the general environment, it cannot be tinned (poor solderability), so the copper surface to be tinned will be protected. The protection methods include HASL, ENIG, Immersion Silver, Immersion TIn, and organic solder preservative (OSP). Each method has its own advantages and disadvantages, collectively referred to as surface treatment.

SFSdvd (1)
SFSdvd (2)

PCB Techinecal Capacity

Layers Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size 1150mm × 560mm
Aspect Ratio 18:1
Surface Finish HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control

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